It was less than a year ago that SK Hynix started to mass-produced HBM2E, but the memory manufacturer is already working on the next generation of HBM memory. Named HBM3, the next-gen memory promises to deliver speeds of up to 5.2Gbps per chip, which translates into a bandwidth of over 665GB/s.
SK Hynix’s HBM2E is one of the fastest DRAM solutions out there. For each 16GB chip, HBM2E offers a maximum I/O speed of 3.6Gbps and a maximum bandwidth of 460GB/s, about 9x faster than GDDR6.
With HBM3, which is still under development, SK Hynix plans to push speeds and bandwidth even further. HBM3 chips can achieve a speed of 5.2Gbps, resulting in a maximum bandwidth of 665GB/s. That’s a 44.6% improvement over its predecessor.
Although 5.2Gbps is already quite impressive, memory manufacturer SiFive (via Tom’s Hardware) has previously announced its plans to release HBM3 memory capable of reaching speeds of 7.2Gbps.
KitGuru says: We probably won’t see HBM in gaming graphics cards for quite some time. AMD had previously done it, but the results weren’t what they were cracked up to be. On the other hand, compute accelerators have continued to use HBM, and considering how well HBM performs in this type of workload, we expect to see it being used in these solutions for the foreseeable future.
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